Fanless Industrial PC

KingYoung Technology provides the most stable and silent fanless industrial PC with strong computing power.

  • E300F PhotoSumicom E300F
    • Intel® Alder Lake S/Raptor Lake S LGA1700 Processors up to 35W TDP
    • Standard-height size: 153 × 250 × 48mm
    • Passive Cooling Design
    • 1 × 2.5 Gigabit Ethernet port
    • 2 × RS-232 ports
    • 2 × DP outputs
    • 4 × M.2 M-Key 2280 slots for PCIe SSDs
    • 3 × M.2 M-key 2230 slots
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  • E300FG3 PhotoSumicom E300FG3
    • Intel® Alder Lake S/Raptor Lake S LGA1700 Processors up to 35W TDP
    • Standard-height size: 153 × 250 × 48mm
    • Passive Cooling Design
    • 4 × 2.5 Gigabit Ethernet ports
    • 1 × RS-232 port
    • 2 × DP outputs
    • 4 × M.2 M-Key 2280 slots for PCIe SSDs
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  • E300XF PhotoSumicom E300XF
    • Intel® Alder Lake S/Raptor Lake S LGA1700 Processors up to 35W TDP
    • Standard-height size: 153 × 250 × 48mm
    • Passive Cooling Design
    • 1 × 2.5 Gigabit Ethernet port
    • 1 × RS-232 port
    • 4 × DP outputs
    • 5 × M.2 M-Key 2280 slots for PCIe SSDs
    • 4 × M.2 M-key 2230 slots
    • Wi-Fi/Bluetooth module expansion slot
    • 5G/4G/LTE module expansion slot
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  • E300XFG3 PhotoSumicom E300XFG3
    • Intel® Alder Lake S/Raptor Lake S LGA1700 Processors up to 35W TDP
    • Standard-height size: 153 × 250 × 48mm
    • Passive Cooling Design
    • 4 × 2.5 Gigabit Ethernet ports
    • 4 × DP outputs
    • 5 × M.2 M-Key 2280 slots for PCIe SSDs
    • 1 × M.2 M-key 2230 slot
    • Wi-Fi/Bluetooth module expansion slot
    • 5G/4G/LTE module expansion slot
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  • E300XFE PhotoSumicom E300XFE
    • Intel® Alder Lake S/Raptor Lake S LGA1700 Processors up to 35W TDP
    • Mid-height size: 153 × 250 × 64mm
    • Passive Cooling Design
    • 1 × 2.5 Gigabit Ethernet port
    • 1 × RS-232 port
    • 4 × DP outputs
    • 5 × M.2 M-Key 2280 slots for PCIe SSDs
    • 4 × M.2 M-key 2230 slots
    • Wi-Fi/Bluetooth module expansion slot
    • 5G/4G/LTE module expansion slot
    • 1 × PCIe x4 Half Length Add-In-Card Slot
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  • E300XFEG3 PhotoSumicom E300XFEG3
    • Intel® Alder Lake S/Raptor Lake S LGA1700 Processors up to 35W TDP
    • Mid-height size: 153 × 250 × 64mm
    • Passive Cooling Design
    • 4 × 2.5 Gigabit Ethernet ports
    • 1 × RS-232 port
    • 4 × DP outputs
    • 5 × M.2 M-Key 2280 slots for PCIe SSDs
    • 1 × M.2 M-key 2230 slot
    • Wi-Fi/Bluetooth module expansion slot
    • 5G/4G/LTE module expansion slot
    • 1 × PCIe x4 Half Length Add-In-Card Slot
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  • E300C PhotoSumicom E300C
    • Intel® Alder Lake S Pentium and Celeron Low Power Processors (LGA1700)
    • Small size: 160 × 250 × 58mm
    • Passive Cooling Design
    • 1 × 2.5 Gigabit Ethernet port
    • 2 × RS-232 ports
    • 2 × DP outputs
    • 4 × M.2 M-Key 2280 slots for PCIe SSDs
    • 3 × M.2 M-key 2230 slots
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  • E300CX PhotoSumicom E300CX
    • Intel® Alder Lake S Pentium and Celeron Low Power Processors (LGA1700)
    • Small size: 160 × 250 × 58mm
    • Passive Cooling Design
    • 1 × 2.5 Gigabit Ethernet port
    • 1 × RS-232 port
    • 4 × DP outputs
    • 5 × M.2 M-Key 2280 slots for PCIe SSDs
    • 4 × M.2 M-key 2230 slots
    • Wi-Fi/Bluetooth module expansion slot
    • 5G/4G/LTE module expansion slot
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  • E300CG3 PhotoSumicom E300CG3
    • Intel® Alder Lake S Pentium and Celeron Low Power Processors (LGA1700)
    • Small size: 160 × 250 × 58mm
    • Passive Cooling Design
    • 4 × 2.5 Gigabit Ethernet ports
    • 1 × RS-232 port
    • 2 × DP outputs
    • 4 × M.2 M-Key 2280 slots for PCIe SSDs
    More Details
  • E300CXG3 PhotoSumicom E300CXG3
    • Intel® Alder Lake S Pentium and Celeron Low Power Processors (LGA1700)
    • Small size: 160 × 250 × 58mm
    • Passive Cooling Design
    • 4 × 2.5 Gigabit Ethernet ports
    • 4 × DP outputs
    • 5 × M.2 M-Key 2280 slots for PCIe SSDs
    • 1 × M.2 M-key 2230 slot
    • Wi-Fi/Bluetooth module expansion slot
    • 5G/4G/LTE module expansion slot
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  • S51M-X16 PhotoSumicom S51M-X16
    • NVIDIA® Jetson™ Orin NX 16GB
    • Fanless design
    • Ultra Small Form Factor
    • New Flexible Modular Expansion System
    • Customized NVIDIA® JetPack BSP
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  • S51M-X8 PhotoSumicom S51M-X8
    • NVIDIA® Jetson™ Orin NX 8GB
    • Fanless design
    • Ultra Small Form Factor
    • New Flexible Modular Expansion System
    • Customized NVIDIA® JetPack BSP
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  • S51M-N8 PhotoSumicom S51M-N8
    • NVIDIA® Jetson™ Orin Nano 8GB
    • Fanless design
    • Ultra Small Form Factor
    • New Flexible Modular Expansion System
    • Customized NVIDIA® JetPack BSP
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  • S51M-N4 PhotoSumicom S51M-N4
    • NVIDIA® Jetson™ Orin Nano 4GB
    • Fanless design
    • Ultra Small Form Factor
    • New Flexible Modular Expansion System
    • Customized NVIDIA® JetPack BSP
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  • S51-X16 PhotoSumicom S51-X16
    • NVIDIA® Jetson™ Orin NX 16GB
    • Fanless design
    • Ultra Small Form Factor
    • Customized NVIDIA® JetPack BSP
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  • S51-X8 PhotoSumicom S51-X8
    • NVIDIA® Jetson™ Orin NX 8GB
    • Fanless design
    • Ultra Small Form Factor
    • Customized NVIDIA® JetPack BSP
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  • S51-N8 PhotoSumicom S51-N8
    • NVIDIA® Jetson™ Orin Nano 8GB
    • Fanless design
    • Ultra Small Form Factor
    • Customized NVIDIA® JetPack BSP
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  • S51-N4 PhotoSumicom S51-N4
    • NVIDIA® Jetson™ Orin Nano 4GB
    • Fanless design
    • Ultra Small Form Factor
    • Customized NVIDIA® JetPack BSP
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  • S385F PhotoSumicom S385F
    • Intel Haswell-ULT Celeron 2980U processors
    • Fanless design
    • Ultra small: 117 × 148 × 52 mm
    • Up to 16GB DDR3 (SODIMM × 2)
    • Built-in 1 Gigabit Ethernet port
    • Built-in 2 RS-232 ports
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  • S385FG3 PhotoSumicom S385FG3
    • Intel Haswell-ULT Celeron 2980U processors
    • Fanless design
    • Ultra small: 117 × 148 × 52 mm
    • Up to 16GB DDR3 (SODIMM × 2)
    • Built-in 4 Gigabit Ethernet ports
    • Built-in 2 RS-232 ports
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  • S695F PhotoSumicom S695F
    • Intel 8th & 9th FCLGA1151 low power CPUs
    • Small size: 160 × 250 × 58 mm
    • Up to 64GB DDR4 (SODIMM × 2)
    • Built-in 1 Gigabit Ethernet port
    • Built-in 1 RS-232 port
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  • S695FG3 PhotoSumicom S695FG3
    • Intel 8th & 9th generation FCLGA1151 low power CPUs
    • Small size: 160 × 250 × 58 mm
    • Up to 64GB DDR4 (SODIMM × 2)
    • Built-in 4 Gigabit Ethernet port
    • Built-in 1 RS-232 port
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  • S685F PhotoSumicom S685F
    • Intel 4th generation FCLGA1150 low power CPUs
    • Fanless design
    • Small size: 160 × 250 × 58 mm
    • Up to 16GB DDR3 (SODIMM × 2)
    • Built-in 1 Gigabit Ethernet port
    • Built-in 1 RS-232 port
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  • S695FC PhotoSumicom S695FC
    • Intel 8th & 9th FCLGA1151 low power CPUs
    • Small size: 160 × 250 × 58 mm
    • Up to 64GB DDR4 (SODIMM × 2)
    • Built-in 1 Gigabit Ethernet port
    • Built-in 1 RS-232 port
    • Power-on delay and remote power on/off
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  • S685FG3 PhotoSumicom S685FG3
    • Intel 4th generation FCLGA1150 low power CPUs
    • Fanless design
    • Small size: 160 × 250 × 58 mm
    • Up to 16GB DDR3 (SODIMM × 2)
    • Built-in 4 Gigabit Ethernet ports
    • Built-in 1 RS-232 port
    More Details
  • S675F PhotoSumicom S675F
    • Intel 3rd and 2nd generation Intel Core mobile CPUs
    • Fanless design
    • Small size: 160 × 250 × 58 mm
    • Up to 16GB DDR3 (SODIMM × 2)
    • Built-in 1 Gigabit Ethernet port
    • Built-in 1 RS-232 port
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  • S675FC PhotoSumicom S675FC
    • Intel 3rd and 2nd generation Intel Core mobile CPUs
    • Fanless design
    • Car PC: wide input voltage range
    • Small size: 160 × 250 × 58 mm
    • Up to 16GB DDR3 (SODIMM × 2)
    • Built-in 1 Gigabit Ethernet port
    • Built-in 1 RS-232 port
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